Asian Development Bank - Japan Scholarship Program

Host University Recommendation Scholarships

Asian Development Bank - Japan Scholarship Program (ADB-JSP)

Applications for September 2023 enrollment have closed. Thank you to all who applied. The following is information from the already closed 2023 enrollment application cycle and should be treated as reference only.

Note: ADB-JSP is available only for those participating in our Master's Program in Economic Development

1. Eligibility Requirements

To apply for the Asian Development Bank - Japan Scholarship Program, Applicants must:

  • Be a national of an ADB borrowing member country (applicants from countries that are no longer borrowing from ADB are not eligible for the ADB-JSP Scholarship).
  • Have gained admission to an approved post graduate course in any of the participating academic institutions.
  • Possess a bachelor's degree or its equivalent including a superior academic record.
  • Have at least two (2) years of full-time professional working experience.
  • Proficiency in oral and written English communication skills to be able to pursue studies.
  • Not be more than 35 years old at the time of application.
  • Be in good health.
  • Agree to return to his/her home country after completion of studies under the Program.

Those ineligible to apply include:

  • Staff members of participating academic institutions.
  • Executive Directors, Alternate Directors, management and staff of ADB, consultants, and relatives of the aforementioned.
  • Applicants living or working in a country other than their home country.

[ Note ]

ADB-JSP does not sponsor undergraduate studies, distance learning programs, short-term training, conferences, seminars, thesis writing, or research projects.

2. Application

Please read over the following documents containing important information about the Asian Development Bank - Japan Scholarship, and procedures to apply for admission at Ritsumeikan University with a chance to be recommended for this scholarship:

Application Procedures

3. Deadline

Application Deadline: February 21, 2023

4. Additional Information

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