Asian Development Bank - Japan Scholarship Program

Host University Recommendation Scholarships

Asian Development Bank - Japan Scholarship Program (ADB-JSP)



ATTENTION: An Additional Application Window for this scholarship-based admission opportunity is now open!
APPLICATION DEADLINE: February 21, 2023
Read the following for details.



Note: ADB-JSP is available only for those participating in our Master's Program in Economic Development

1. Eligibility Requirements

To apply for the Asian Development Bank - Japan Scholarship Program, Applicants must:

  • Be a national of an ADB borrowing member country (applicants from countries that are no longer borrowing from ADB are not eligible for the ADB-JSP Scholarship).
  • Have gained admission to an approved post graduate course in any of the participating academic institutions.
  • Possess a bachelor's degree or its equivalent including a superior academic record.
  • Have at least two (2) years of full-time professional working experience.
  • Proficiency in oral and written English communication skills to be able to pursue studies.
  • Not be more than 35 years old at the time of application.
  • Be in good health.
  • Agree to return to his/her home country after completion of studies under the Program.

Those ineligible to apply include:

  • Staff members of participating academic institutions.
  • Executive Directors, Alternate Directors, management and staff of ADB, consultants, and relatives of the aforementioned.
  • Applicants living or working in a country other than their home country.

[ Note ]

ADB-JSP does not sponsor undergraduate studies, distance learning programs, short-term training, conferences, seminars, thesis writing, or research projects.


2. Application

Please read over the following documents containing important information about the Asian Development Bank - Japan Scholarship, and procedures to apply for admission at Ritsumeikan University with a chance to be recommended for this scholarship:

Application Procedures


3. Deadline

Application Deadline: February 21, 2023


4. Additional Information

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